5G Base Station Solutions

With the rapid development of 5G communications the market penetration of 5G small base stations is increasing.
Due to miniaturization constraints The density and complexity of base station electronic assemblies is also increasing.In order to ensure the reliable operation of electronic components.We can use Fehonda conductive glue in the shell splicing.Strong surface adhesion and good shielding effect.EMC or EMI shielding can be realized.Inside some of the main heat chip place. We can add Fehonda thermal  gel or thermal pad to help dissipate heat.Improve the overall reliability.