FDI-1023 Thermal Conductive Insulators
Features and Benefits
- Electrically isolating
- Low mounting pressures
- Low thermal impedance
- General-purpose thermal interface material solution
- Smooth and highly compliant surface
- Enhanced puncture ,shear and tear resistance
Typical Applications
- Consumer electronics / Telecommunications / Medical devices / Industrial controls
- Between CPU or other heatgenerating component and a heat sink
- Isolate electrical components and power sources from heat sink and or mounting bracket
- Telecommunications Computer and peripherals Power conversion Consumer electronics
| Parameters | Unit | Value | Test Standard |
|---|---|---|---|
| Color | / |
Pink
|
Visual |
| Thickness | mm |
0.23
|
ASTM D374 |
| Hardness | Shore A |
80
|
ASTM D2240 |
| Thermal Conductivity | W/m.k | 0.8 | ASTM D5470 |
| Flame Rating | / | V-0 | UL 94 |
| Tensile Strength | Mpa | 30 | ASTM D412 |
| Dielectric Breakdown Voltage | KV/mm | ≥3 | ASTM D149 |
| Volume Resistivity | Ω.cm | ≥ 1012 | ASTM D257 |
| Temperature Range | ℃ | –40~200 | / |
| Substrate | / | Glassfifiber | / |
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