FDI-TSP10 Thermal Conductive Insulators
Features and Benefits
- Electrically isolating
- Low mounting pressures
- Low thermal impedance
- General-purpose thermal interface material solution
- Smooth and highly compliant surface
- Enhanced puncture ,shear and tear resistance
Typical Applications
- Consumer electronics / Telecommunications / Medical devices / Industrial controls
- Between CPU or other heatgenerating component and a heat sink
- Isolate electrical components and power sources from heat sink and or mounting bracket
- Telecommunications Computer and peripherals Power conversion Consumer electronics
| Parameters | Unit | Value | Test Standard |
|---|---|---|---|
|
Color
|
/ |
Yellow
|
Visual
|
|
Thickness
|
mm
|
0.15
|
ASTM D374
|
|
Hardness
|
Shore A
|
90
|
ASTM D2240
|
|
Thermal Conductivity
|
W/m.k
|
1.3
|
ASTM D5470
|
| Flame Rating | / | V-0 | UL 94 |
|
Tensile Strength
|
Mpa
|
26
|
ASTM D412
|
|
Dielectric Breakdown Voltage
|
KV/mm
|
≥6
|
ASTM D149
|
|
Volume Resistivity
|
Ω.cm
|
≥ 1012
|
ASTM D257
|
|
Temperature Range
|
℃
|
–50~180
|
/
|
|
Substrate
|
/ |
PI
|
/ |
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