3.8w Thermal Gel
Features and Benefits
- Low thermal impedance
- Two-part formulation for easy storage
- Room temperature cure or Heat cure
- Ultra-conforming, designed for fragile and low-stress applications
- Thixotropic nature makes it easy to dispense
- Excellent low and high temperature mechanical and chemical stability
Typical Applications
- Telecommunications / Computer and peripherals
- Fiber optic telecommunications equipment
- Between any heat-generating semiconductor and a heat sink
- Automative systems / Consumer electronics / Artificial intelligence / Fiber Module
PROPERTIES | Unit | Value | Test Standard |
---|---|---|---|
Color
|
/ |
A(White)/B(Red)
|
Visual
|
Mix Ratio
|
/ |
1:1
|
/ |
Pot life@25℃
|
hrs
|
3
|
/ |
Cure @25℃
|
hrs |
12
|
/ |
Cure@100℃
|
min
|
10 | / |
Hardness
|
Shore C
|
35±10
|
ASTM D2240
|
Density
|
g/cc
|
3.1±0.3
|
ASTM D792
|
Dielectric Breakdown Voltage
|
kV/mm
|
≥6
|
ASTM D149
|
Volume Resistivity
|
Ω.cm
|
≥1012
|
ASTM D257
|
Thermal Conductivity
|
W/mk
|
3.8
|
ASTM D5470
|
Thermal Impendence@40psi&2mm
|
℃.in /w
|
≤0.06
|
ASTM D5470
|
Flame Rating
|
/ |
V-0
|
UL 94
|
Temperature Range
|
℃
|
-40~160
|
/ |