8.0W Thermal Gel
Features and Benefits
- Low thermal impedance
- Two-part formulation for easy storage
- Room temperature cure or Heat cure
- Ultra-conforming, designed for fragile and low-stressapplications
- Thixotropic nature makes it easy to dispense
- Excellent low and high temperature mechanical and chemical stability
Typical Applications
- Telecommunications / Computer and peripherals
- Fiber optic telecommunications equipment
- Between any heat-generating semiconductor and a heat sink
- Automative systems / Consumer lectronics / Artifificial intelligence / Fiber Module
| PROPERTIES | Unit | Value | Test Standard |
|---|---|---|---|
| Color | / | A(White)/B(Grey) | Visual |
| Mix Ratio | / | 1:1 | / |
| Pot life@25℃ | hrs |
0.5
|
/ |
| Cure @25℃ | hrs |
2
|
/ |
| Cure@100℃ | min |
5
|
/ |
| Hardness | Shore C |
25±10
|
ASTM D2240 |
| Density | g/cc | 3.1±0.3 | ASTM D792 |
| Dielectric Breakdown Voltage | kV/mm | ≥6 | ASTM D149 |
| Volume Resistivity | Ω.cm | ≥1012 | ASTM D257 |
| Thermal Conductivity | W/mk |
8.0
|
ASTM D5470 |
| Thermal Impendence@40psi&2mm | ℃.in /w |
≤0.01
|
ASTM D5470 |
| Flame Rating | / | V-0 | UL 94 |
| Temperature Range | ℃ | -40~160 | / |
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