2.0W Thermal Pad

Self-adhesive on both sides, not easy to peel off, soft, good compressibility, high reliability in long-term use, can be used for heat transfer between semiconductors, power devices and housings or other heat sinks.

Thermal Conductivity： 2.0 W/m.k
Hardness：Shore C 20~45
Thickness：0.5～6.0mm
Breakdown Voltage：＞6～10 Kv/mm

Inquiry

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

2.0W Thermal Pad

Parameters	Unit	Regular	Low permeation Oil	Test Standard
Thermal Conductivity	W/m·k	2.0	2.0	ASTM D5470
Hardness	Shore C	20~45	20~45	ASTM D2240
Density	g/cc	2.5±0.2	2.5±0.2	ASTM D792
Thickness	mm	0.5~6.0	0.5~6.0	ASTM D374
Breakdown Voltage	Kv/mm	＞ 6	＞ 6	ASTM D149
Volume Resistivity	Ω.cm	≥10¹³	≥10¹³	ASTM D257
Silicone Permeability	%	≤3	≤1	125°C/72h（compression50%）
Temperature Range	℃	-40~180	-40~180	/
Flame Rating	/	V-0	V-0	UL 94

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