3.0W FEHONDA Thermal Pad
3.0W Fehonda Thermal Pad is an advanced thermal management solution designed to meet the cooling needs of high-performance electronic components. Offering a thermal conductivity of 3.0W/m·K, this thermal pad efficiently transfers heat from processors, GPUs, and other power components to a heatsink or cooling surface, ensuring optimal device performance and longevity.
Why Choose 3.0W Fehonda Thermal Pads?
As a leading manufacturer, we specialize in providing customized thermal pads tailored to meet the specific requirements of our clients. With years of experience in the thermal management industry, we understand the importance of delivering solutions that are not only high-performance but also precisely aligned with your needs. Our thermal pads can be customized in terms of size, color, hardness, viscosity, insulation properties, and thermal conductivity. Whether you're designing a new product or looking for a specific thermal solution, our professional R&D team is ready to collaborate and develop the perfect thermal pad for you.
- Thermal Conductivity： 3.0 W/m.k
- Hardness：Shore C 20~45
- Thickness：0.5～6.0mm
- Breakdown Voltage：＞6～10 Kv/mm
| Parameters | Unit | Regular | Low permeation Oil | Test Standard |
|---|---|---|---|---|
| Thermal Conductivity | W/m·k | 3.0 | 3.0 |
ASTM D5470
|
| Hardness | Shore C |
20~45
|
20~45 |
ASTM D2240
|
| Density |
g/cc
|
2.9±0.2
|
2.9±0.2 |
ASTM D792
|
| Thickness | mm |
0.5~6.0
|
0.5 - 6.0 |
ASTM D374
|
| Breakdown Voltage | Kv/mm |
＞ 6
|
＞ 6
|
ASTM D149
|
| Volume Resistivity | Ω.cm | ≥10¹³ | ≥10¹³ |
ASTM D257
|
|
Silicone Permeability
|
%
|
≤3
|
≤1 |
125°C/72h（compression50%）
|
| Temperature Range | ℃ | -40~180 | -40~180 |
/
|
|
Flame Rating
|
/
|
V-0
|
V-0 |
UL 94
|
Key Features of 3.0W Fehonda Thermal Pad:
- Thermal Conductivity: 3.0W/m·K for effective heat dissipation.
- Customizable: Tailored to meet your specifications in size, color, hardness, viscosity, and more.
- Versatile: Suitable for CPUs, GPUs, power modules, LEDs, and other high-performance electronics.
- Easy to Apply: Ready-to-use pads that simplify the installation process.
- Long-Lasting Performance: Made from premium materials for durability and longevity.
Applications:
- CPUs & GPUs in computers and gaming systems
- Power Modules in automotive and industrial electronics
- LEDs and Lighting Systems
- Telecommunications Equipment
- Power Electronics in various high-tech devices
By choosing our 3.0W Fehonda Thermal Pads, you are ensuring your products will operate at peak performance while also benefiting from our ability to provide customized solutions that are designed specifically for your application. Contact us today to discuss how we can assist you with your thermal management needs.
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