LTP81 Liquid Thermal Pad
Liquid Thermal Pad is a high-quality thermal conductive material that is used to eliminate the problem of overheating of electronic components in computers, laptops, and other electronic devices.
This composition is very easy to install. You don't have to measure the thickness of your old thermal pads or look up the specification online. Often these thicknesses simply cannot be found on the Internet. This is why this liquid thermal pad from Fehonda is needed.
Fehonda LTP81 is a one-component liquid thermal pad that forms a dense layer of compound that ensures good contact between the surface of the component and the cooling system.
This thermal pad does not contain metal particles and does not corrode metals, which allows it to be used on all types of surfaces. LTP81 is easy to apply using the included spatula.
| Parameters | Unit | Regular | Test Standard |
|---|---|---|---|
| Thermal Conductivity | W/m·k | 18.0 | / |
| Density | g/cc | 3.85±0.2 | ASTM D792 |
| Hardness | shore C | 15±3 | ASTM D2240 |
| Breakdown voltage | Kv/mm | ＞9 | ASTM D149 |
| Volume Resistivity | Ω.cm | ≥1012 | ASTM D257 |
| Size | g | 12 / 25 / 50 | / |
| Temperature Range | ℃ | -40~180 | / |
| Flame Rating | / | V-0 | UL 94 |
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