PCM8990 Thermal Phase Change Pad
Fehonda PCM8990 Thermal Phase Change Pad is designed for efficient heat conduction in various applications. The pad utilizes high thermal conductivity materials to effectively transfer heat from electronic components or heat sources to heat sinks or cooling devices, ensuring optimal performance and preventing overheating.
Designed to provide superior thermal conductivity, PCM-8990 thermal interface material is trusted by industries to deliver reliable, efficient thermal conductivity for a wide range of applications.
Thermal Conductivity: 8.5 W/mk
Phase Change temperature: 52 ℃
Thickness: 0.25 mm
Density: 2.6-2.8 g/cm³
Thermal resistance: 0.03℃ cm²/W
Temperature Tolerance Range: -55~+180 ℃
PCM8990 is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. It is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable
Application at a competitive cost.
PCM-8990, based on a novel polymer PCM system, exhibits excellent interface wetability during typical operating temperature ranges,resulting in extremely low surface contact resistance. Since PCM-8990 comes only in 0.25mm (thicker versions are under development).
you need to be sure that this thickness is compatible and suitable for the flatness of your package.
PCM-8990 is a proprietary material that provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.03˚Ccm2/W @ no shim), making the PCM-8990 series desirable for high performance integrated circuit devices. is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. It is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable.