Thermally conductive potting adhesives

The role of thermally conductive potting adhesives:

  • Protect sensitive circuits and components
  • Resist environmental contamination and prevent damage to products
  • Suitable for products that require good heat dissipation for potting materials
Parameters Unit Value Test method
Density g/cc 1.5±0.15 ASTM D792
Hardness Shore C 75±5 ASTM D2240
Elongation % ≥10 ASTM D412
Tensile Strength MPa ≥2.0 ASTM D412
Permittivity F/m ≥3.8 ASTM D150
Volume Resistivity Ω.cm ≥10¹³ ASTM D257

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FEHONDA's new materials are used in a variety of applications around the world, providing effective solutions for thermal conductivity, shielding and more for products. Our sales and engineering support teams are ready to help you with any questions you may have, including quotations, product application support and product customization. Please submit your request via our custom service form to ensure a faster response.

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